Underfill coating for loc package
作者： Walter L. Moden
DOI:
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摘要: An LOC die assembly is disclosed including a dielectrically adhered to the underside of lead frame. underfill material introduced between each finger and semiconductor die, extending from bonding location edge in order prevent filler particles lodging leads active surface during transfer molding plastic encapsulant. The seal created by reduces point stresses on usually caused particles. decreased flexure further enhances locking position with respect die.
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