Method, apparatus and program for filling liquid material
作者： Kazumasa Ikushima
DOI:
关键词:
摘要: Provided are a method, an apparatus and computer program for filling liquid material, which do not require complicated parameter calculation affect the moving speed of discharge unit. In method gap between substrate work placed thereon with material discharged from unit by utilizing capillary action, is characterized in forming application pattern made up region non-application along outer periphery work, correcting amount extending contracting region. The carrying out also provided.
lens.org 参考文章(28)
Ikushima Kazumasa, METHOD FOR APPLYING LIQUID AND DEVICE FOR APPLYING LIQUID ,(2001)
Ikushima Kazumasa, CONSTANT-RATE DISCHARGER FOR LIQUID ,(1992)
裕治 大武, Shigetaka Abe, Yuji Otake, 成孝 阿部, Adjustment of application quantity for bond for adhering electronic component ,(1997)
Yumiko Ohshima, Takahito Nakazawa, Flip-chip semiconductor package ,(1997)
Walter L. Moden, Underfill coating for loc package ,(1997)
Alexander Lupisan Anit, Naoya Ian Nagano, Thomas Laferl Ratledge, Christopher L. Giusti, Alan Lewis, Method of implementing multiple pump speeds for dispensing a viscous material ,(2003)
Kuo K. Wang, Sejin Han, Pressurized underfill encapsulation of integrated circuits ,(1996)
Patrick T. Hogan, Duong T. La, John Sharpless, Spray gun with five axis movement ,(1990)
Satoru Hachinohe, Takehisa Kajikawa, Kazuo Kasue, Method for fabricating circuit module ,(2003)
Jason Zhang, Robert Starkston, Marking on underfill ,(2004)