Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice

摘要: A method and apparatus for increasing the integrated circuit density in a flip chip semiconductor device assembly decreasing time dielectrically filling such using less dielectric material. The includes conductively bumped die an interposer substrate having multiple recesses formed therein. is mounted to with bumps disposed so that face directly adjacent surface of substrate. One or more openings may be provided opposing lower periphery thereof which extends conductive Dielectric filler material then through one recesses.