Warpage-proof circuit board structure
作者： Wei-Hung Lin
DOI:
关键词:
摘要: The invention provides a warpage-proof circuit board structure, including: an inner layer board; at least one dielectric formed on surface of the first groove in corresponding position thereto; solder mask layer, second and to layer; metal frame grooves protruding from mask, thereby strengthening prevent it warping thermal processing further using as heat-dissipating means for package structure.
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