Interposer, packages including the interposer, and methods

摘要: An interposer including a substantially planar substrate element with slot formed therethrough. The slot, through which bond pads of semiconductor die are exposed upon assembly the die, includes laterally recessed area in only portion periphery thereof. is positioned so as to expose at least an active surface located between pad adjacent outer and periphery. facilitates access by apparatus for forming, positioning, or securing intermediate conductive elements. Semiconductor device assemblies packages that include also disclosed, methods assembling components packaging such assemblies.