Semiconductor packages and methods for making the same

摘要: Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the of present invention and semiconductor packages using same also Reject on defective substrates a element covered prior encapsulation process member. The member comprises, example, pressure-sensitive temperature-activated tape, dies, like. methods virtually eliminate bleeding flashing during due presence sites. further ensure that functional dice not sacrificed by being sites, thereby decreasing manufacturing costs while increasing yield packages.