Integrated circuit device and method to prevent cracking during surface mount
作者： Tadashi Saitoh , Boon Q. Seow , Thiam B. Lim
DOI:
关键词: Materials science 、 Integrated circuit packaging 、 Coating 、 Soldering 、 Polyimide 、 Optoelectronics 、 Integrated circuit 、 Semiconductor package 、 Printed circuit board 、 Electronic engineering 、 Quad Flat No-leads package
摘要: A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers an integrated circuit. The circuit has polyimide coating on backside. An encapsulating material surrounds the and so that are exposed. backside of helps reduce cracking arising from mounting printed board relflow solder.
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