Method for producing semiconductor element and adhesive sheet for adhering wafer

摘要: A method for producing a semiconductor element, comprising treating lead frame or wafer chip, and chip in combination, with at least one package crack-preventing compound selected from compounds having reactive group, acids, derivatives group due to which said acid assumes acidity, siloxane of the formula (I) ##STR1## number average molecular weight not more than 10,000 comprising, their structure, derivative; an adhesive adhering wafer, is usable production method. According method, cracks can be significantly prevented.