Semiconductor device having a flat protective adhesive sheet
作者： Kinya Atsumi , Hiroshi Muto , Yasuo Souki , Shinji Yoshihara
DOI:
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摘要: A semiconductor device has a wafer having sensing portions exposed on surface thereof and an adhesive sheet attached to the as protective cap cover portions. The is composed of flat disposed generally entire sheet. Adhesion selectively reduced by UV irradiation have adhesion regions, regions face can be produced with high productivity, securely protect when diced transported.
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