Semiconductor device and method for producing the same by dicing
作者： Hiroshi Muto , Sumitomo Inomata , Shinji Yoshihara , Tetsuo Fujii
DOI:
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摘要: A protective sheet is fixed to a jig, and regions of the corresponding where dicing-cut be performed are removed form grooves. Then, semiconductor wafer bonded at an opposite side jig detached from together. After that, cut into chips by dicing along grooves sheet. Because not dicing, no scraps produced, thereby preventing contamination chips.
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