Manufacturing method of a package structure
作者： Cheng-Yin Lee , Gwo-Liang Weng
DOI:
关键词:
摘要: A manufacturing method of a package structure is provided. Firstly, substrate having surface Next, chip disposed on the substrate. Then, packing material layer formed thin film pasted layer. and are thoroughly cut along cutting line around by first blade but not thoroughly. at least part second such that exposed. The width larger than blade.
lens.org 参考文章(10)
Hiroshi Muto, Sumitomo Inomata, Shinji Yoshihara, Tetsuo Fujii, Semiconductor device and method for producing the same by dicing ,(2004)
Alejandro Hurtado, Mounting and dicing process for wafers ,(2004)
Shu-Shen Chiu, Te-Tsung Chao, Process for separating dies on a wafer ,(2003)
Xin Hui Lee, Kun-Ching Chen, Yi-Chuan Ding, Chip scale package and manufacturing method ,(2002)
David Ovrutsky, Yulia Aksenton, Felix Hazanovich, Robert Burtzlaff, Vage Oganesian, Osher Avsian, Charles Rosenstein, Michael J. Nystrom, Avi Dayan, Ilya Hecht, Andrey Grinman, Mitchell Hayes Reifel, Giles Humpston, Wafer level chip packaging ,(2007)
David B Tuckerman, Michael J Nystrom, Charles Liam Goudge, Anita Woll, Giles Humpston, Structure and method of making lidded chips ,(2007)
Chi-Chuan Wu, Chien-Ping Huang, Method of singulating a batch of integrated circuit package units constructed on a single matrix base ,(2000)
Sato Nobuyuki, Dousen Noriaki, Takahashi Wataru, Semiconductor device and method of manufacturing the same ,(1998)
Joseph K. Fauty, James P. Letterman, Jay A. Yoder, Semiconductor component and method of manufacture ,(2007)