Integrated circuit chip manufaturing method and semiconductor device
作者： Kazutaka Momoi , Nobuhiko Sato
DOI:
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摘要: This invention moderates the difficulty in chip formation or packaging which accompanies thinning of a semiconductor region where an integrated circuit is formed. An manufacturing method includes first bonding step support member to surface substrate has and second including on side thereof, removing surface-side portion bonded leave region, thereby substrate, thinned forming chips by cutting region.
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