Method of making semiconductor package with heat spreader
作者： Tzong-Da Ho , cheng-Hsu Hsiao , Chien Ping Huang
DOI:
关键词: Semiconductor package 、 Interface layer 、 Chip carrier 、 Heat spreader 、 Chip 、 Materials science 、 Optoelectronics 、 Adhesion force 、 Electronic engineering
摘要: A method is provided of making a semiconductor package with heat spreader in which chip carrier module plate consisting plurality array-arranged carriers mounted at least one on each the carriers. attached to chips, an interface layer formed top surface plate. The plate, chips and are encapsulated. Adhesion force between encapsulant larger than that adhesion smaller encapsulant.
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