Surface roughening method for embedded semiconductor chip structure
作者： Shih-Ping Hsu
DOI:
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摘要: A surface roughening method for an embedded semiconductor chip structure is proposed. The includes providing a carrier board with opening and mounting in the of board, having plurality electrode pads; performing process on pads chip, so as to form rough exposed by board. Thus, adhesion between dielectric layer improved during subsequently forming circuit build-up layers roughened
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