Semiconductor package and fabrication method thereof

摘要: A semiconductor package and a fabrication method thereof are provided in which chip is mounted on substrate, dielectric layer applied over the substrate chip, with bond fingers formed electric contacts being exposed outside. metal contacts, patterned to form plurality of conductive traces that electrically connect substrate. The replace conventional wire bonding technology thus eliminate occurrence sweep or short circuits processes. Therefore, low profile reduced pitch between adjacent can be used without limited feasibility technology.