Chip module and method for fabricating a chip module
作者： Josef Hoeglauer , Martin Standing , Ralf Otremba
DOI:
关键词:
摘要: The chip module includes a semiconductor having first contact element on main face and second face. is arranged corner in such way that the of faces carrier. One or more electrical connectors are connected to carrier include end located plane above chip.
lens.org 参考文章(9)
Toshiyuki Hata, Hiroshi Sato, Semiconductor packaging device comprising a semiconductor chip including a MOSFET ,(2005)
Manfred Mengel, Henrik Ewe, Joachim Mahler, Integrated circuit device having a gas-phase deposited insulation layer ,(2007)
Chien Ping Huang, Han-Ping Pu, Semiconductor package and fabrication method thereof ,(2013)
Robert M. Smith, Charles H. Wilson, John J. Maloney, Quad flat no-lead chip carrier with stand-off ,(2008)
Rikiya Kamimura, Masaya Mizutani, Kimiharu Kayukawa, Elektronische Vorrichtung und Verfahren zu deren Fertigung ,(2011)
Ming Sun, Demei Gong, Flip chip mounted semiconductor device package having a dimpled leadframe ,(2007)
Meikei Ieong, Devendra K. Sadana, Ghavam Shahidi, Method to form Si-containing SOI and underlying substrate with different orientations ,(2004)
Xaver Schlögel, Klaus Schiess, Ralf Otremba, Charlie Tan Tien Batu Berendam Lay, Semiconductor module, has carrier arranged on semiconductor chip such that one main surface of semiconductor chip faces carrier, where insulating layer and wiring layer covers another main surface of semiconductor chip and carrier ,(2007)
Kouji Furusawa, Objective lens actuator assembly for an optical disk drive ,(1997)