Printed circuit board including embedded electronic component and method for manufacturing the same
作者： Doo Hwan Lee , Seung Eun Lee , Yee Na Shin , Yul Kyo Chung
DOI:
关键词:
摘要: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: core having cavity; component inserted into the cavity rough surface formed on surfaces of external electrodes provided both lateral portions thereof, low being in portion surfaces; insulating layers laminated upper and lower bonded to outer circumferential insertedly positioned pattern layers.
lens.org 参考文章(15)
Shih-Ping Hsu, Surface roughening method for embedded semiconductor chip structure ,(2006)
Jae-Kul Lee, Doo-Hwan Lee, Sang-Jin Baek, Jin-soo Jeong, Sang-Chul Lee, Jong-Yun Lee, Electro device embedded printed circuit board and manufacturing method thereof ,(2010)
Teruhisa Hayashi, Kouki Ogawa, Yasutake Hotta, Printed wiring substrate and method for fabricating the same ,(2001)
Seiji Shirai, Hideo Yahashi, 克敏 伊藤, 英郎 矢橋, 誠二 白井, Katsutoshi Ito, Capacitor and multilayered printed wiring board ,(2000)
Yasushi Inagaki, Motoo Asai, Seiji Shirai, 東冬 王, 元雄 浅井, Hideo Yahashi, 英郎 矢橋, 誠二 白井, Touto O, 靖 稲垣, Printed wiring board and capacitor ,(2000)
Yasuhiro Morizono, Yasuhide Ohno, Keisuke Tsutsumi, Toshiyuki Kozuka, Method and material for plating film formation ,(2007)
Kim Go Eun, Lin Dong Chung, Seo Young Won, MULTILAYER CERAMIC CAPACITOR, PRINTED CIRCUIT BOARD INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF ,(2011)
Oyama Yasuhiko, Hayashi Satoshi, Fukuoka Masateru, Shimomura Kazuhiro, Sugita Taihei, Kitajima Giichi, Hatai Munehiro, Asada Manabu, IC CHIP WITH THROUGH-ELECTRODE ,(2006)
Chang Wen-Sung, Kung Jiang-Wen, Lin Wei-Hung, Method of fabricating circuit board structure having embedded semiconductor component ,(2008)