Capacitor and multilayered printed wiring board
作者： Seiji Shirai , Hideo Yahashi , 克敏 伊藤 , 英郎 矢橋 , 誠二 白井
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摘要: PROBLEM TO BE SOLVED: To provide a capacitor which is suitable for being housed or built in multilayered printed wiring board. SOLUTION: A board, at least part of its surface makes contact angle 7 to 45 deg. with respect water, and subjected plasma processing, cleaning, an acid treatment. Furthermore, after the this coating layer formed thereon. The interlayer resin insulating layers, conductor circuits are successively on board formation capacitor, circuit, upper lower circuit connected through via holes.
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