Component-embedded substrate
作者： Masanori Fujidai , Isamu Fujimoto
DOI:
关键词: Electrode 、 Substrate (printing) 、 Optoelectronics 、 Laser processing 、 Materials science 、 Component (thermodynamics) 、 Electrical engineering 、 Layer (electronics) 、 Electrical conductor
摘要: Disclosed is a component-embedded substrate through which wiring can be easily run by simply forming vias, without changing laser processing conditions for each via, needing longer (deeper) and separate process such as build-up process. Furthermore, the diameters of vias kept small. Wiring blocks (5A 5B) component (3) are embedded in layer (4), conductive layers formed over entire surfaces 5B). The arranged that on bottom electrodes (3A) contact with bottom-surface (6B). Via conductors (7) above top (3). Said via electrically connect (6A) surface (4)
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