Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein
作者： Hye Seong Kim , Hee Jung Jung
DOI:
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摘要: There are provided a multilayer ceramic electronic component to be embedded in board and manufacturing method thereof, particularly, board, which thickness of body an entire chip is increased by not allowing for increase external electrode while forming band surface the have predetermined length or greater connecting wiring through via hole, such that strength may improved occurrence damage as breakage, like prevented, provided.
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