Thermally enhanced lead-under-paddle I.C. leadframe
作者： Prasad V. V. Yalamanchili
DOI:
关键词:
摘要: A "lead-under-paddle" (LUP) leadframe employs a thermally conductive paddle/heat sink, the top side of which is adhered to an I.C. die with adhesive. The inner portions package's leads extend along and are attached bottom paddle electrically isolating Heat generated by conducted out package via sink. in close contact die, reducing leadframe's thermal resistance, increasing amount power that can be consumed enabling standard accommodate having larger respective surface areas.
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