Thermally efficient integrated circuit package

摘要: A leadframe that exhibits improved thermal dissipation and can be incorporated in standard integrated circuit (IC) package designs is provided by extending the inner lead portions along a major surface of an IC, attaching heat sink on side opposite IC. The conduct from IC to sink, where it dissipated into moulding compound radiated air. In preferred embodiment, leads have outer are arranged only two opposing sides comprise four sets initially intersect lateral sides. This allows for larger number contribute dissipation. Added achieved making portion ground wider than any other lead. addition, existing utilize present structure accommodate ICs before because does not require positioned between tips portions.