Leadframe having one or more power/ground planes without vias
作者： Tsing-Chow Wang , Louis H. Liang
DOI:
关键词:
摘要: Power and ground connections are provided using one or more conductive layers in an integrated-circuit package design (10, 100). A leadframe has either a tape assembly (30, 32, 34, 36) heat-conducting dielectric ceramic substrate (252) attached to the die-attach paddle (14, 104) of planes (34, 36; 256, 258) formed on top surface (252). The includes metal layer 36), polyimide (32), adhesive (30). pad 406) used as low inductance power providing integrated-circuit. No vias used. Use (406) for is optional when (402)
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