LEAD FRAME FOR SEMICONDUCTOR INTEGRATED CIRCUIT

摘要: PURPOSE:To reduce the number of pins used for a power source and ground to accommodate them in package smaller than normal one by providing bonding region potential different from an integrated circuit board between semiconductor inner lead pin. CONSTITUTION:A frame is separated at its die pad into two regions land 6 7 ground. In diagram 3 when used, 8 bonded 6, 9 7. Accordingly, even if there are plurality pads 10, 11 ground, they can be coped with 13, 15. Thus, total outer reduced that source, on circuit, accommodated one.