Lead frame design for increased chip pinout

摘要: An integrated circuit (IC) module incorporates a modified lead frame having die attach platform, plurality of leads extending away from the and bus bars surrounding platform. Multiple I/O pads on an IC chip mounted platform requiring common power supply voltage or communication signals are connected to bar, allowing greater variety be provided fixed number IC-PCB interconnections module. The bar design is readily incorporated into all packaging techniques using conventional manufacturing processes. embodiment for BGA package also includes circular attachment at ends in order provide area mounting solder balls ensure consistent flow uniform final ball profile without vias.