Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection
作者： KiYoun Jang , Seongwon Park , KyungHoon Lee , Jaehyun Lee
DOI:
关键词:
摘要: A semiconductor device includes a die. An interconnect structure is formed over an active surface of the encapsulant die and including first opposite structure. peripheral portion roughness disposed outside footprint second less than The within mold around to contact that third equal fourth roughness. 1.0 micrometers. in range 1.2-1.8
google.nl 参考文章(20)
Yoong Oh, Semicondiuctor package substrate and method for manufacturing the same ,(2011)
Ying-Shih Lin, Huan-Wen Chen, Shih-Chieh Chiu, Chih-Hung Hsu, Chip package structure, chip package mold chase and chip package process ,(2010)
JoonDong Kim, KyungHoon Lee, KiYoun Jang, Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material ,(2013)
Tung Lok Li, Integrated circuit package having a castellated heatspreader ,(2009)
Stephen Martin, Dan Kinzer, Yong Liu, Wafer level stack die package ,(2010)
Tzong-Da Ho, cheng-Hsu Hsiao, Chien Ping Huang, Method of making semiconductor package with heat spreader ,(2001)
Chien-Yuan Tseng, Chi-Chih Chu, Cheng-Yi Weng, Stackable semiconductor device packages ,(2010)
Arthur Cornfeld, Daniel McGlynn, Tansen Varghese, Epitaxial lift off in inverted metamorphic multijunction solar cells ,(2012)
Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau, Belgacem Haba, Microelectronic packages and methods therefor ,(2006)