Method for positioning dicing line of wafer
作者： Keisuke Goto , Kenichi Yokoyama
DOI:
关键词: Wafer 、 Wafer testing 、 Wafer dicing 、 Die preparation 、 Electronic engineering 、 Wafer backgrinding 、 Optoelectronics 、 Layer (electronics) 、 Probe card 、 Materials science 、 Line (electrical engineering)
摘要: A method for positioning a dicing line includes the steps of: bonding an adhesive tape on semiconductor layer of wafer; detecting image wafer by imaging device basis light transmitted through and determining position marker, which is disposed wafer. The marker obtained recognition from detected
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