作者: Andrew J. Krivy , Larry D. Angell
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摘要: A system and method for cleaning probe pins on a card used in testing semiconductor device during fabrication thereof. ceramic wafer is utilized to clean the without having remove from production line. The same apparatus test wafers also handles cycle. During operation of cycle, placed manual load tray, which inserts into prober machine. transported by robotic trolley prealign stage area where aligned centered. then support device. are positioned under pneumatic sensor profiled determine planarity. underneath be cleaned. Thereafter, z-axis distance between surface decreased such that contact wafer, thereby removing debris pins. removed when has been completed.