作者: Sekiya Kazuma
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摘要: PROBLEM TO BE SOLVED: To provide a package substrate processing method, with which it is possible to reliably divide along division planned line from back surface side, and positional relation detection device for use in the method.SOLUTION: A method includes: step obtaining correlation of on whose front first mark formed second associated formed; holding so that its placed table exposed; position imaging held by detect calculating obtain line; cutting line.