DICING APPARATUS AND DICING METHOD FOR SEMICONDUCTOR WAFER

摘要: PROBLEM TO BE SOLVED: To provide a dicing apparatus and method for semiconduc tor wafer which can cut semiconductor from the side opposite to circuit pattern side, simplify manufacturing process of device, improve productivity. SOLUTION: In divides 1 on patterns are formed into each chip unit 1', while is held by sheet 5, an infrared radiation applied illumination 15 reflected light picked up camera 14 recognize boundary lines BL chips units along side. With such constitution, be so that device simplified productivity improved.