Method of making integrated circuit package containing inner leads with knurled surfaces

摘要: A lead on chip package comprising a semiconductor having plurality of bonding pads and minute protrusions formed at both side portions the upper surface thereof, an insulating film made fluoroethylene knurled surfaces, inner leads each directly connected to corresponding pad provided with surfaces. The formation is accomplished by using radio frequency (RF)-sputtering process low temperature. surfaces can be passing between rollers outer or coating nodule dendrite layer over electro-plating high current density. Using film, reduce in thickness. By virtue adhesion improved. It also possible prevent occurrence parasitic capacitance. As result, there effect assisting packages laminate.