Anti-scavenging solders for silver metallization
作者： Jian-Ku Shang , Rong-Fong Huang , Ross A. Miesem
DOI:
关键词: Materials science 、 Metallurgy 、 Soldering 、 Scavenging 、 Solder alloy 、 Range (particle radiation) 、 Particle size
摘要: Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to alloy (12) with particle size sufficient preserve metallization during use concentration maximize effectiveness avoid adverse effects on reflow characteristics. Preferably, in range approximately 5 µm 20 5% 10%.
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