Rf printed circuit module and method of making same
作者： William Witherspoon Hayes
DOI:
关键词: Electrical connection 、 Materials science 、 Layer (electronics) 、 Distributed circuit 、 Surface mounting 、 Electrical engineering 、 Printed circuit board 、 Dielectric layer 、 Optoelectronics
摘要: The present invention discloses an RF printed circuit module and the method of making it. includes a first single-clad sheet having dielectric layer metal attached to top surface thereof, second bottom double-clad with surface, wherein is positioned between sheets. layers are etched form desired lumped distributed elements thereon. sheets provide ground planes portions external terminals for module. edge-plated along perimeter thereof connect sheets, portion such edge-plating being removed on one side pair permit electrical connection thereto by mounting arrangement. Vias also included in order electrically at least sheet.
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