Modular thin film distributed filter
作者： Mark Hamilton Broman , Mark Brooks
DOI:
关键词:
摘要: A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. component defining depositions are arranged to overlap and couple one another with connecting vias. Alternative 800 MHz 1.9 GHz circuits disclosed. Bordering ground conductors covering planes shield impedance resonator overlapping capacitor elements. layers accommodate range frequencies permit pre-fabrication subsequent laser trimming, assembly packaging.
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