RF powered plasma enhanced chemical vapor deposition reactor and methods

作者: Gurtej S. Sandhu , Paul Smith , Sujit Sharan

DOI:

关键词: Plasma-enhanced chemical vapor depositionRF power amplifierOptoelectronicsInterference (communication)ElectrodePower (physics)SemiconductorThermocoupleElectrical engineeringMaterials science

摘要: Plasma enhanced chemical vapor deposition (PECVD) reactors and methods of effecting the same are described. In a preferred implementation, PECVD reactor (10) includes processing chamber (12) having first electrode (16) therewithin. A second (18) is disposed within configured for supporting at least one semiconductor workpiece processing. RF power source (26) delivers frequency to electrode. (32) Preferably frequencies different from another, even more preferably, greater than frequency. The thermocouple (28) which provides temperature information relative electrodes. According loop developed by grounded interiorly in manner reduces if not eliminates interference with other components including thermocouple.

参考文章(34)
Michael Welch, Hongching Shan, Robert Wu, Hiroji Hanawa, Broad-band adjustable power ratio phase-inverting plasma reactor ,(1995)
Tadahiro Ohmi, Device for plasma process ,(1990)
Mustapha Elyaakoubi, Jacques Schmitt, Jerome Perrin, Capacitively coupled RF-plasma reactor ,(1998)
Diwakar Garg, Paul N. Dyer, George Vakerlis, Ward D. Halverson, Radio frequency plasma enhanced chemical vapor deposition process and reactor ,(1990)
Mitsuaki Komino, Yoichi Ueda, Kouichi Kazama, Kenji Ishikawa, Method of controlling temperature of susceptor ,(1993)
Evans Lee, Robert Wu, Hongching Shan, Adjustable dc bias control in a plasma reactor ,(1994)
Robert Wu, Gerald Z. Yin, Inductively enhanced reactive ion etching ,(1994)
Siamak Salimian, Lumin Li, Carol M. Heller, Dual-frequency capacitively-coupled plasma reactor for materials processing ,(1995)
Andreas G. Hegedus, Glenn R. Corn, Variable duty cycle, multiple frequency, plasma reactor ,(1985)