Solid-state imaging device, manufacturing method thereof, and electronic apparatus
作者： Yosuke Ogata
DOI:
关键词: Signal processing 、 Light sensing 、 Optoelectronics 、 Semiconductor 、 Solid-state 、 Molding (process) 、 Image signal 、 Electronic engineering 、 Substrate (printing) 、 Materials science
摘要: Disclosed is a solid-state imaging device including: element which outputs an image signal according to amount of light sensed on sensing surface; semiconductor performs processing with respect the output from element; and substrate electrically connected element, in sealed by molding resin state being accommodated accommodation area provided substrate, layered via resin.
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