Image sensor package and fabrication method thereof
作者： Jui-Ping Weng , Jang-Cheng Hsieh , Pai-Chung Peter Zung , Tzu-Han Lin
DOI:
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摘要: The invention provides an image sensor package and method for fabricating the same. comprises a first substrate comprising device thereon hole therein. A bonding pad opening is formed on upper surface of substrate. second spacer element with therein disposed conductive plug in passes through openings to electrically contact pad. layer lower connects plug. solder ball by further relatively less thick, thus, dimensions thereof are reduced.
lens.org 参考文章(20)
Ephie Koltin, Yacov Malinovich, Backside illuminated image sensor ,(1999)
Chih-Min Pao, Chi-Hao Chiu, Chi-Ta Chuang, Chien Liu, Package structure with a heat spreader and manufacturing method thereof ,(2004)
Bedabrata Pain, Method for implementation of back-illuminated CMOS or CCD imagers ,(2005)
Takashi Yasudome, Kazuya Fujita, Hiroaki Tsukamoto, Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication ,(2008)
Mark Hiatt, Kyle K. Kirby, David R. Hembree, Warren M. Farnworth, James M. Wark, Sidney B. Rigg, Alan G. Wood, Charles M. Watkins, Steven D. Oliver, Lu Velicky, Mark E. Tuttle, Salman Akram, Through-wafer interconnects for photoimager and memory wafers ,(2010)
Masahiro Sunohara, Mitsutoshi Higashi, Kei Murayama, Naohiro Mashino, Electronic parts packaging structure and method of manufacturing the same ,(2004)
Avner Pierre Badehi, Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby ,(2000)
Kyle K. Kirby, David R. Hembree, Warren M. Farnworth, James M. Wark, William M. Hiatt, Peter A. Benson, Alan G. Wood, Charles M. Watkins, Salman Akram, Sidney B. Rigg, Microelectronic imagers and methods of packaging microelectronic imagers ,(2004)