Pad design for circuit under pad in semiconductor devices
作者： Vincent Venezia , Keh-Chiang Ku , Duli Mao , Hsin-Chih Tai , Wei Zheng
DOI:
关键词:
摘要: Embodiments of a semiconductor device that includes substrate and cavity disposed in the extends at least from first side to second substrate. The also an insulation layer over coating sidewalls cavity. A conductive including bonding pad is layer. into connects metal stack below through silicon via connected stack. position accept via.
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