Die-cavity pocketing via cutting simulation

作者: Byoung K. Choi , Bo H. Kim

DOI: 10.1016/S0010-4485(97)00031-6

关键词: Cutting forceAlgorithmEngineeringComputer simulationMachiningComputer-aided manufacturingSimulationOffset (computer science)

摘要: Abstract For die-cavity pocketing, the cavity volume is sliced into a number of cutting-layers by horizontal cutting-planes, and each layer pocket-machined using contour-parallel offset method in which tool-paths are obtained repeatedly offsetting boundary-pocketing curve. The major challenges pocketing include: 1) finding for obtaining curve, 2) generating evenly spaced toolpaths, 3) detecting removing uncut-regions, 4) estimating chip-loads an adaptive feed control. No systematic solution these problems has been offered literature, except curve methods computing curves. Presented article straightforward approach to all four handled successfully existing cutting-simulation methods.

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