作者: Wen-Xiu Wang , Li-Sha Niu , Yang-Yang Zhang , En-Qiang Lin
DOI: 10.1016/J.COMMATSCI.2012.05.035
关键词: Modulus 、 Nanometre 、 Young's modulus 、 Elongation 、 Thin film 、 Composite material 、 Characteristic length 、 Ultimate tensile strength 、 Bulk modulus 、 Materials science 、 Nanotechnology
摘要: Abstract Molecular dynamics (MD) methods using Tersoff potential are employed to study the nanomechanical behaviors of 3C-SiC (0 1 0) thin films under [1 0 0]-oriented tension. In this work, Young’s modulus, tensile strength and elongation compared with those bulk for different temperatures. The results show that modulus nanofilms is size dependent softer than its counterpart. It found decreases as much 24.7% when thickness film reduces unit lattice, which suggests effect could not be neglected characteristic length shrinks down several nanometers. When more 10 nm, value converges value. As increment very slow, effects neglected. addition, reduction in nanofilm increasing temperature exhibits a nonlinear trend. Moreover, simulations demonstrate also increase temperature. Despite partial degradation, SiC maintains mechanical properties largely at elevated temperatures, makes it attractive applications high environment.