Characteristics of high-purity Cu thin films deposited on polyimide by radio-frequency Ar/H2 atmospheric-pressure plasma jet
作者： P. Zhao , W. Zheng , Y. D. Meng , M. Nagatsu
DOI: 10.1063/1.4795808
关键词: Atmospheric-pressure plasma 、 Evaporation (deposition) 、 Ion plating 、 Hydrogen 、 Polyimide 、 Materials science 、 Analytical chemistry 、 Copper oxide 、 Thin film 、 Auger electron spectroscopy
摘要: With a view to fabricating future flexible electronic devices, an atmospheric-pressure plasma jet driven by 13.56 MHz radio-frequency power is developed for depositing Cu thin films on polyimide, where wire inserted inside the quartz tube was used as evaporation source. A polyimide substrate placed water-cooled copper heat sink prevent it from being thermally damaged. aim of preventing oxidation deposited film, we investigated effect adding H2 Ar film characteristics. Theoretical fitting OH emission line in OES spectrum revealed that gas significantly increased rotational temperature roughly 800 1500 K. The LMM Auger spectroscopy analysis higher-purity were synthesized hydrogen gas. possible explanation enhancement deposition rate and improvement purity addition atomic produced plays important roles heating promote atoms removing oxygen oxide components via reduction reaction.
scitation.org
harvard.edu
osti.gov
irgrid.ac.cn
aip.org参考文章(19)
Davide Mariotti, Yoshiki Shimizu, Takeshi Sasaki, Naoto Koshizaki, Gas temperature and electron temperature measurements by emission spectroscopy for an atmospheric microplasma Journal of Applied Physics. ,vol. 101, pp. 013307- ,(2007) , 10.1063/1.2409318
Claire Tendero, Christelle Tixier, Pascal Tristant, Jean Desmaison, Philippe Leprince, Atmospheric pressure plasmas: A review Spectrochimica Acta Part B: Atomic Spectroscopy. ,vol. 61, pp. 2- 30 ,(2006) , 10.1016/J.SAB.2005.10.003
Stephan Reuter, Jörn Winter, Ansgar Schmidt-Bleker, Helena Tresp, Malte U. Hammer, Klaus-Dieter Weltmann, Controlling the Ambient Air Affected Reactive Species Composition in the Effluent of an Argon Plasma Jet IEEE Transactions on Plasma Science. ,vol. 40, pp. 2788- 2794 ,(2012) , 10.1109/TPS.2012.2204280
Hisashi Nakahiro, Peng Zhao, Akihisa Ogino, Wei Zheng, Yuedong Meng, Masaaki Nagatsu, Effect of Hydrogen Reduction on Characteristics of Cu Thin-Films Deposited by RF-Driven Ar/H2 Atmospheric Pressure Plasma Jet Applied Physics Express. ,vol. 5, pp. 056201- ,(2012) , 10.1143/APEX.5.056201
Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung, Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness Journal of Materials Science: Materials in Electronics. ,vol. 20, pp. 885- 890 ,(2009) , 10.1007/S10854-008-9811-1
Y.-S. Lin, H.-M. Liu, Enhanced adhesion of plasma-sputtered copper films on polyimide substrates by oxygen glow discharge for microelectronics Thin Solid Films. ,vol. 516, pp. 1773- 1780 ,(2008) , 10.1016/J.TSF.2007.07.162
Zhe Kong, Qi Wang, Liang Ding, Tao Wu, Study on chemical vapor deposited copper films on cyano and carboxylic self-assembled monolayer diffusion barriers Thin Solid Films. ,vol. 518, pp. 4852- 4859 ,(2010) , 10.1016/J.TSF.2010.02.016
Yoshiki Shimizu, Kenji Kawaguchi, Takeshi Sasaki, Naoto Koshizaki, Generation of room-temperature atmospheric H2/Ar microplasma jet driven with pulse-modulated ultrahigh frequency and its application to gold nanoparticle preparation Applied Physics Letters. ,vol. 94, pp. 191504- ,(2009) , 10.1063/1.3129168
Chih-hao Yang, Shih-chin Lee, Jun-ming Wu, Tien-chai Lin, The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment Applied Surface Science. ,vol. 252, pp. 1818- 1825 ,(2005) , 10.1016/J.APSUSC.2005.03.182
Jun Sun Eom, Sang Ho Kim, Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate Thin Solid Films. ,vol. 516, pp. 4530- 4534 ,(2008) , 10.1016/J.TSF.2008.01.022