Process of manufacturing compliant wirebond packages
作者： Joseph Fjelstad
DOI:
关键词: Layer (electronics) 、 Mechanical engineering 、 Plasma etching 、 Substrate (printing) 、 Flip chip 、 Frame (networking) 、 Aperture (computer memory) 、 Electronic engineering 、 Chip 、 Engineering 、 Wire bonding
摘要: A method of making a assembly including the steps fitting chip within an aperture in frame, connecting bond pads on frame to contacts by forming wire loops therebetween, dispensing compliant material over and for form layer, plasma etching top surface layer expose portion each loop. The semiconductor can then be incorporated into larger connection external substrate.
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