Semiconductor device include relay chip connecting semiconductor chip pads to external pads
作者： Yoshihiro Saeki
DOI:
关键词: Redistribution layer 、 Lead frame 、 Interconnection 、 Materials science 、 Semiconductor device 、 Electrical engineering 、 Die (integrated circuit) 、 Chip 、 Wire bonding 、 Flip chip
摘要: Disposal and replacement of bonding pads is conducted easily accurately. A semiconductor chip that includes fixed on a die pad. relay the via an insulating material. The are interconnected wiring pattern, which single-layer or multi-layer interconnection structure, convert disposition to different direction. connected wires, lead frame wires.
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