Stacked integrated chip package and method of making same
作者： Qwai H. Low , Maniam Alagaratnam , Chok J. Chia
DOI:
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摘要: A single leadframe package having stacked integrated chips mounted therein provides multiple electrical functions. The construction includes a die substantially smaller outer peripheral dimension than first circuit chip face down thereon for supporting from below the without obstructing its bond pads. second is supported in backside to configuration by pads of circuit. plurality short conductive wires interconnect electrically and with selective ones conductors. An encapsulating material molds into package.
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