Semiconductor device having a plurality of chips
作者： Masaki Waki , Tsuyoshi Aoki , Junichi Kasai , Hirotaka Sato , Toshiyuki Honda
DOI:
关键词:
摘要: A semiconductor device which has a first main surface and second opposed to each other, lead frame (21) that can be bonded on its surfaces, chip (22) arranged the of said frame, tape leads (23) electrically connects chip, (24) (25) chip.
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