RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要: PURPOSE:To provide a resin sealed semiconductor device of structure in which wires are prevented from contact with chip and displacement at molding even if the has electrodes its center. CONSTITUTION:An insulating film 6 provided first 7 connected to 4 element 3, second electrode 8 inner leads 2, wirings 9 connect is pasted on 3 so as make exposed, die-bonded an island, then 4, electrodes, 8, lead 2 bonded together wires, up resin.