Integrated circuit device having a built-in thermoelectric cooling mechanism
作者： Thomas J. McIntyre , Andrew T. S. Pomerene
DOI:
关键词: Thermoelectric cooling 、 Optoelectronics 、 Substrate (printing) 、 Mechanism (engineering) 、 Integrated circuit 、 Electronic circuit 、 Materials science
摘要: An integrated circuit device having a built-in thermoelectric cooling mechanism is disclosed. The includes package and substrate. Contained within the package, substrate has front side back side. Electric circuits are fabricated on of substrate, multiple devices same utilized to dissipate heat generated by electric package.
lens.org 参考文章(8)
Warren M. Farnworth, Semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies ,(1991)
Shou-Yi Shiu, Yu-Ping Fang, Hon-Hung Lui, Integrated thermoelectric cooler formed on the backside of a substrate ,(1997)
Rakesh Bhatia, Package with integrated thermoelectric module for cooling of integrated circuits ,(1999)
Robert M. Perchak, Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing ,(1982)
Errol Wayne Robinson, Uttam Shyamalindu Ghoshal, Steven Alan Cordes, James Louis Speidell, Michael James Cordes, Method and apparatus for thermal management of integrated circuits ,(2000)
Jr. Joel V. Miller, Multi stage thermoelectric power generation ,(1996)
Stephen Michael Zimmerman, Process and structure of an integrated vacuum microelectronic device ,(1992)