Package with integrated thermoelectric module for cooling of integrated circuits
作者： Rakesh Bhatia
DOI:
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摘要: A package for an integrated circuit (IC) comprises a lid attached to base, with the IC being disposed in space or cavity between and base. thermoelectric module (TEM) having first second primary surfaces is incorporated into section of lid. The surface thermally coupled such that application power TEM causes heat be transferred away from IC.
lens.org 参考文章(5)
Mark A. Cardella, Cooling system and method of cooling electronic devices ,(1996)
Noriyasu Sasa, Yuji Iwata, Thermoelectric cooling module and method for manufacturing the same ,(1996)
William F. Shutler, Vito J. Tuozzolo, Richard D. Musa, Joseph M. Mosley, Mohanlal S. Mansuria, Integrated thermoelectric cooling ,(1990)
Eiji Sakamoto, Shinichi Hara, Ryuichi Ebinuma, Wafer holding device in an exposure apparatus ,(1991)
Suemi Tanaka, Yuichi Kimura, Masaaki Yamamoto, Method for manufacturing cooling unit comprising heat pipes and cooling unit ,(1999)