Integrated thermoelectric cooling
作者： William F. Shutler , Vito J. Tuozzolo , Richard D. Musa , Joseph M. Mosley , Mohanlal S. Mansuria
DOI:
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摘要: A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, thermoelectric cooler within the and chip connected to cooler, thus providing in itself dissipates thermal energy generated by chip.
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