Method for manufacturing cooling unit comprising heat pipes and cooling unit
作者： Suemi Tanaka , Yuichi Kimura , Masaaki Yamamoto
DOI:
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摘要: The present invention relates to a cooling unit for electronic devices wherein the manufacturing method comprises steps of: (a) preparing plate-type metal block removing heat generated from an component, having holes in thickness part of and convex portions formed on one main surface or both surfaces block; (b) inserting pipes into holes; (c) applying local two-dimensional force make flat bringing outer each pipe close contact with inner wall hole block.
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